ShenZhen KaiZhuo Electronic Technology Co.,Ltd
SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD PCB |Component Sourcing |PCB Assembly| Solution Optimization -----Provide technique support
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Large long FR4 PCBA Components Assembly Circuit Testing Function SMT PCB Assembly PCB Assembly Service
Features
What KAZ Circuit can do for you:
To get a full quotation of the PCB/PCBA, pls provide the information as below:
| Capacity | Double sided:12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~30 layers |
| Material | FR4, Aluminum, PI,MEGTRON MATERIAL |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg135~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
KAZ Circuit has been operating as a manufacturer of PCB&PCBA since 2007. specialized in quick-turn manufacturing of prototypes and small to middle volume series of rigid, flex, rigid-flex and multilayer boards.as well as aluminium substrate circuit board.we have a strong strength on fabrication of Roger board, MEGTRON MATERIAL board and 2&3 steps HDI boards and etc.
Beside with Seven SMT production lines and 2 DIP lines.we provide one-stop service to our customers.
SMT PCB assembly procedure:
PCB Prep:
Clean the PCB substrate to remove any contaminants that may affect solder joint quality.
Apply solder mask to the PCB to identify copper pads where components will be placed.
A surface treatment such as ENIG (Electroless Nickel Immersion Gold) is applied to the copper pads to promote solderability.
Solder paste print:
Place the stencil over the PCB with the stencil's openings matching the PCB's copper pads.
The solder paste (a mixture of solder alloy particles and flux) is scraped across the stencil, depositing the solder paste on the pads of the PCB.
Precise control of stencil thickness, solder paste volume, and squeegee pressure are critical for consistent solder paste deposition.
Element placement:
Automatic pick-and-place machines use vision systems to accurately identify component locations and place them on the solder paste.
Component orientation, coplanarity, and positional accuracy are critical to reliable solder joints.
Additional components such as connectors or heat sinks can be placed manually.
reflow soldering
PCB components are passed through a reflow oven with carefully controlled temperature profiles.
The solder paste melts, moistening the component leads and PCB pads, and forms a solder joint as it cools.
Different solder alloys, such as lead-free (such as tin-silver-copper), have specific reflow temperature profiles.
Inspection and Testing:
Visual inspection (manual or automated) checks for proper component placement, solder joint quality, and potential defects.
Automated optical inspection (AOI) systems use machine vision to quickly identify and locate any problems.
Electrical testing, such as in-circuit testing (ICT) or functional testing, verifies the electrical performance of the PCB.
Clean and Conformal Coating (optional):
PCB assemblies may undergo a cleaning process to remove any remaining solder paste or flux.
Conformal coating is a polymeric protective layer that can be applied to PCBs to increase moisture and environmental resistance.
SMT PCB assembly requires strict control over the entire process to ensure high quality and reliability of electronic products. Continuous improvements in automation, process control, and inspection technologies are critical to the widespread use of SMT in modern electronics manufacturing.
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