ShenZhen KaiZhuo Electronic Technology Co.,Ltd
SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD PCB |Component Sourcing |PCB Assembly| Solution Optimization -----Provide technique support
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Blind / Burried Holes 4-10 Layers FR4 HDI Printed Circuit Board PCB
Detaill specification
| Product name | Multilayer FR4 ENIGHASLOSP HDI Printed Circuit Boards With Blind&Burried holes |
| Material | FR-4 |
| Surface treatment | ENIG/ HASL/ OSP and so on |
| Board thickness | 0.6-1.6mm or more thicker |
| Copper thickness | 0.5-3oz |
| Soldermask | Black/ Green/ Red/ Blue |
| Silkscreen | White |
| Certificates | ISO9001 | UL ( E337072 ) | TS16949 ( 0259279 ) | RoHS |
Shenzhen KAZ Circuit Co., Ltd.
Brief introduction
Shenzhen KAZ Circuit Co., Ltd, found in 2007, is a PCB and PCBA custom-made manufacturer. It's commitment to high precision single, double-sided, multilayer printed circuit board and metal substrate circuit board production,which is a hightech enterprises including amnufacture, sales, service and so on.
We are confident to provide you quality products with factory-directed price within the fastest delivery time!
What KAZ Circuit can do for you:
Manufacturer Capacity:
| Capacity | Double Sided: 12000 sq.m / month Multilayers: 8000sq.m / month |
| Min Line Width/Gap | 4/4 mil (1mil=0.0254mm) |
| Board Thickness | 0.3~4.0mm |
| Layers | 1~20 layers |
| Material | FR-4, Aluminum, PI |
| Copper Thickness | 0.5~4oz |
| Material Tg | Tg140~Tg170 |
| Max PCB Size | 600*1200mm |
| Min Hole Size | 0.2mm (+/- 0.025) |
| Surface Treatment | HASL, ENIG, OSP |
HDI printed circuit boards, also known as microvia or μvia PCBs, are an advanced PCB technology that enable high-density interconnections and miniaturized electronic components.
Key features and functions of HDI printed circuit boards include:
Miniaturization and increased density:
HDI PCBs feature smaller, more closely spaced vias and vias, allowing for higher interconnect density.
This makes it possible to design more compact, space-saving electronic devices and components.
Microvias and Stacked Vias:
HDI PCBs use microvias, which are smaller, laser-drilled holes that are used to connect different layers of the PCB.
Stacked vias, where multiple vias are stacked vertically, can further increase interconnect density.
Multi-layer structure:
HDI PCBs can have a higher layer count than traditional PCBs, typically 4 to 10 or more.
The increased number of layers allows for more complex routing and more connections between components.
Advanced materials and processes:
HDI PCBs often use specialized materials such as thin copper foil, high-performance laminates, and advanced plating techniques.
These materials and processes enable the creation of smaller, more reliable, higher-performance interconnects.
Improved electrical properties:
The reduced trace widths, shorter signal paths, and tighter tolerances of HDI PCBs help improve electrical performance, including improved signal integrity, reduced crosstalk, and faster data transmission.
Reliability & Manufacturability:
HDI PCBs are designed for high reliability, with features like improved thermal management and enhanced mechanical stability.
Manufacturing processes for HDI PCBs, such as laser drilling and advanced plating techniques, require specialized equipment and expertise.
HDI printed circuit board applications include:
Smartphones, Tablets, and Other Mobile Devices
Wearable Electronics and IoT (Internet of Things) Devices
Automotive electronics and advanced driver assistance systems (ADAS)
High speed computing and telecommunications equipment
Military and aerospace electronic equipment
Medical devices and instruments
The continued demand for miniaturization, enhanced functionality, and higher performance in a variety of electronic products and systems has driven the adoption of HDI PCB technology.
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