This is a PCB with 12 layers, min line width and space is 2mil/2mil, specialty include impedance control, blind & buried via, BGA wtih soldmask defined,

Detials for this 12 layers min 2 mil line width high Tg High Density Interconnect HDI PCB:

12 layers
FR-4
Tg 150
ENIG surface
1.6mm board thickness
BGA with soldmask defined
With inpedance control
With Blind & buried via

Copper Thickness:

L1-------------------------------1/3OZ + Plating

PP 3.00mil

L2-------------------------------1/3OZ + Plating

PP 2.35mil

L5-------------------------------1/3OZ + Plating

PP 2.97mil

L6-------------------------------1/3OZ + Plating

PP 2.51mil

L5------------------------------H OZ

0.2mm Core

L6------------------------------H OZ

PP 2.75mil

L7-------------------------------H OZ

0.2mm Core

L8-------------------------------H OZ

PP 2.64mil

L9-------------------------------1/3OZ + Plating

PP 2.83mil

L10------------------------------1/3OZ + Plating

PP 2.43mil

L11------------------------------1/3OZ + Plating

PP 3.09mil

L12------------------------------1/3OZ + Plating

More photoes for this 12 layers HDI PCB

Product Tags:

high density interconnect pcb

fr4 pcb specification

hdi printed circuit boards

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