ShenZhen KaiZhuo Electronic Technology Co.,Ltd

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Cards PCBA Manufacturer CY PCI-E 2 Lane M.2 NGFF 30mm 42mm SSD to EP121 UX21 Electronic circuit Printed Board Assembly

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ShenZhen KaiZhuo Electronic Technology Co.,Ltd
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsHelen Jiang
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Cards PCBA Manufacturer CY PCI-E 2 Lane M.2 NGFF 30mm 42mm SSD to EP121 UX21 Electronic circuit Printed Board Assembly

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Brand Name :KAZ
Model Number :KAZA-007
Certification :UL&ROHS
Place of Origin :China
MOQ :1 Unit
Payment Terms :T/T, Western Union, MoneyGram, L/C, D/A
Supply Ability :2000 m2 / Month
Delivery Time :10 ~ 20 wprking days
Packaging Details :P/P
Layer Count :2 ` 30 Layers
Max Board Size :600 mm x 1200 mm
Base Material for PCB :FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material
Rang of Finish Baords Thickness :0.21-7.0mm
Minimum Line Width :3mil (0.075mm)
Minimum Line Space :3mil (0.075mm)
Minimum Hole Diameter :0.10 mm
Finishing Treatment :HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
Thickness Of Copper :0.5-14oz (18-490um)
E-Testing :100% E-Testing (High Voltage Testing); Flying Probe Testing
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CY PCI-E 2 Lane M.2 NGFF 30mm 42mm SSD to EP121 UX21 UX31 ADATA XM11 SSD Add on Cards PCBA

1. Cards PCBA

• Material: FR4 Tg180, 6-layer
• Minimum trace/space: 0.1mm
• Blind and buries via and via in pad
Material: FR4, high Tg
RoHS Directive-compliant
Board thickness: 0.4-5.0 mm +/-10%
Layer count: 1-22 layers
Copper weight: 0.5-5oz
Min finish hole side: 8 mils
Laser drill: 4 mils
Min trace width/space: 4/4 mils (production), 3/3 mils (sample run)
Solder mask: green, blue, white, black, blue and yellow
Legend: white, black and yellow
Max board dimensions: 18*2 inches
Finish type options: gold, silver, tin, hard gold, HASL, LF HASL
Inspection standard: ipc-A-600H/IPC-6012B, class 2/3
Electronic test: 100%
Report: final inspection, E-test, solder ability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant , ISO 9001:2008, ISO/TS16949:2009

2. Cards Capability

SMT Position accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
PCB weight:3KG
Wave-Solder Max. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Sweat-Solder Metal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Air bladder rate:less than20%
Press-fit Press range:0-50KN
Max. PCB size:800X600mm
Testing ICT,Probe flying,burn-in,function test,temperature cycling

3. Cards PCBA

Cards PCBA Manufacturer CY PCI-E 2 Lane M.2 NGFF 30mm 42mm SSD to EP121 UX21 Electronic circuit Printed Board Assembly

Cards PCBA Manufacturer CY PCI-E 2 Lane M.2 NGFF 30mm 42mm SSD to EP121 UX21 Electronic circuit Printed Board Assembly

Cards PCBA Manufacturer CY PCI-E 2 Lane M.2 NGFF 30mm 42mm SSD to EP121 UX21 Electronic circuit Printed Board Assembly

Cards PCBA Manufacturer CY PCI-E 2 Lane M.2 NGFF 30mm 42mm SSD to EP121 UX21 Electronic circuit Printed Board Assembly



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