PCB, Material of FR4 Tg180, 6-layer, Minimum Trace/Space 0.1mm, Blind and buries Via and Via in Pad
1. Features
• Material: FR4 Tg180, 6-layer
• Minimum trace/space: 0.1mm
• Blind and buries via and via in pad
Material: FR4, high Tg
RoHS Directive-compliant
Board thickness: 0.4-5.0 mm +/-10%
Layer count: 1-22 layers
Copper weight: 0.5-5oz
Min finish hole side: 8 mils
Laser drill: 4 mils
Min trace width/space: 4/4 mils (production), 3/3 mils (sample run)
Solder mask: green, blue, white, black, blue and yellow
Legend: white, black and yellow
Max board dimensions: 18*2 inches
Finish type options: gold, silver, tin, hard gold, HASL, LF HASL
Inspection standard: ipc-A-600H/IPC-6012B, class 2/3
Electronic test: 100%
Report: final inspection, E-test, solder ability test, micro section
Certifications: UL, SGS, RoHS Directive-compliant , ISO 9001:2008, ISO/TS16949:2009
2. PCBA Technical capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP |
| Max. component height::25mm |
| Max. PCB size:680×500mm |
| Min. PCB size:no limited |
| PCB thickness:0.3 to 6mm |
| PCB weight:3KG |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited |
| Component height:Top 120mm/Bot 15mm |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum |
| Surface Finish:plating Au, plating sliver , plating Sn |
| Air bladder rate:less than20% |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
2. PCBA Pictures
