Multilayer PCB board PCB Printed Circuit Board
1. Circuit Board Features
1. One Stop OEM Service, Made in Shenzhen of China
2. Manufactured by Gerber File and BOM List from Customer
3. FR4 Material, Meet 94V0 standard
4. SMT, DIP technology suport
5. Lead Free HASL, Environmental Protection
6. UL, CE, ROHS Compliant
7. Shipping By DHL,UPS, TNT, EMS or Customer requirement
2. Circuit Board Technical capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP |
| Max. component height::25mm |
| Max. PCB size:680×500mm |
| Min. PCB size:no limited |
| PCB thickness:0.3 to 6mm |
| PCB weight:3KG |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited |
| Component height:Top 120mm/Bot 15mm |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum |
| Surface Finish:plating Au, plating sliver , plating Sn |
| Air bladder rate:less than20% |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
A multilayer PCB (Printed Circuit Board) is a type of circuit board that consists of multiple layers of conductive material separated by insulating layers. It is used to provide complex interconnections between electronic components in various electronic devices.
Multilayer PCBs are commonly used in applications where a high level of circuit complexity or density is required. By using multiple layers, these boards can accommodate a larger number of components and connections compared to single or double-sided PCBs. This makes them suitable for advanced electronic devices such as smartphones, computers, networking equipment, and automotive electronics.
The construction of a multilayer PCB involves sandwiching multiple layers of copper traces and insulating material together. The inner layers consist of a core material, typically made of fiberglass-reinforced epoxy resin (FR-4), which is pre-preg material impregnated with epoxy resin. Copper foil is then laminated to both sides of the core material, forming the inner conductive layers.
To create the desired interconnections, the inner layers are etched to remove unwanted copper and create the circuit traces. These traces form the electrical pathways between components and are typically connected through plated-through holes (PTHs) that penetrate the entire thickness of the board.
The outer layers of a multilayer PCB are typically made of copper foil laminated to the top and bottom surfaces of the inner layers. The outer layers are also etched to create circuit traces and can be covered with a solder mask to protect the copper and provide insulation. The final step involves applying a silkscreen layer for component labeling and identification.
The number of layers in a multilayer PCB can vary depending on the complexity of the circuit and the space available within the device. Commonly used multilayer PCB configurations include 4-layer, 6-layer, 8-layer, and even higher layer counts.
Designing and manufacturing multilayer PCBs require specialized software tools and manufacturing processes. PCB design software allows engineers to define the circuit layout, interconnections, and component placement. The manufacturing process involves a series of steps, including layer stacking, drilling, plating, etching, solder mask application, and final inspection.
Overall, multilayer PCBs offer increased design flexibility, reduced size, enhanced electrical performance, and improved signal integrity compared to single or double-sided PCBs. They play a crucial role in enabling the development of advanced electronic devices with complex functionality.
2. Circuit Board Pictures
